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Design Guidelines For Surface Mount Technology

Author: John Traister
Publisher: Elsevier
ISBN: 032314165X
Size: 36.85 MB
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Design Guidelines for Surface Mount Technology covers the basics and the mechanics of surface mounted design technology. Surface mount technology (SMT) embodies an automated circuit assembly process, using a generation of electronic components called surface mounted devices (SMDs). Organized into eight chapters, the book discusses the component selection, space planning, materials and processes, and total concept needed to ensure a manufacturable design. The opening chapters of the book examine the significant requirements and variables affecting SMT and SMDs. The book then deals with the substrate materials specifications, including fabrication and material planning, assembly, design rules, layout guidelines, package outlines, and bar code labeling. The next chapters describe the manufacturing and assembly processes in SMDs and process-proven footprint patterns for each of the component types used, as well as guidelines for creating a suitable pattern on future products. Other chapters discuss the component spacing requirements for SMT and the generation of footprint patterns for passive and active components of SMDs. The concluding chapter describes the design criteria for maximizing machine insertion of leaded electronic components into printed circuit boards (PCBs). These criteria aid the PCB designer by detailing the considerations and some of the trade-offs that will provide reliable insertion in a production environment. Supplementary texts on surface mount equipment, supplies, and services are also provided. Design engineers and researchers will find this book invaluable.

Design Guidelines For Surface Mount Technology

Author: John E. Traister
Publisher: Academic Pr
ISBN:
Size: 52.72 MB
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Contents: Component Selection; Space Planning and Interface; Specifying Material for Substrates; The SMT Assembly Process; Contact Geometry for SMT Components; Design Guidelines; Artwork Generation. Appendixes. This book is a practical, engineering-level guide to designing with surface mounting technology and the manufacturing processes involved.

Fine Pitch Surface Mount Technology

Author: Phil Marcoux
Publisher: Springer Science & Business Media
ISBN: 1461535328
Size: 50.90 MB
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Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.

Surface Mount Technology

Author: Ray P. Prasad
Publisher: Springer Science & Business Media
ISBN: 9401165327
Size: 36.29 MB
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Surface Mount Technology is not a technology of tommorrow but a technology of today. It provides a quantum jump in the packaging tech nology to produce state-of-the-art miniaturized electronic products. How ever, in order to take advantage of this technology, a complete infrastruc ture must be put in place. This requires considerable investment in human and capital resources. Intel corporation has made these investments to keep its customers for components and systems on the leading edge of technology. Based on the experience of putting this infrastructure in place for system products, this book is written for managers who need to manage the risk during its implementation, and the practicing engineers who need to improve the design and manufacturing processes for improved yield and cost reduction. To accomplish this task, I have not only culled the infor mation from published materials, but have also depended on input from both my colleagues in Intel and such outside organizations as the Institute of interconnecting and Packaging electronic Circuits (IPC) , the Electronics Industries Association (EIA), and the Surface Mount Council. But the underlying basis for this book has been my first-hand experience in im plementing this technology for Intel Systems Group and my experience at Boeing, my previous employer. In a fast-changing technology like SMT, it is very easy to have obsolete information even before the book is published. For this reason, I have concentrated on the basic principles and practice of the technology.

Integrated Circuit Hybrid And Multichip Module Package Design Guidelines

Author: Michael Pecht
Publisher: John Wiley & Sons
ISBN: 9780471594468
Size: 46.21 MB
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Circuit designers, packaging engineers, printed board fabricators,and procurement personnel will find this book's microelectronicpackage design-for-reliability guidelines and approaches essentialfor achieving their life-cycle, cost-effectiveness, and on-timedelivery goals. Its uniquely organized, time-phased approach to design,development, qualification, manufacture, and in-service managementshows you step-by-step how to: Define realistic system requirements in terms of missionprofile, operating life, performance expectations, size, weight,and cost Define the system usage environment so that all operating,shipping, and storage conditions, including electrical, thermal,radiation, and mechanical loads, are assessed using realisticdata Identify potential failure modes, sites, mechanisms, andarchitecture-stress interactions—PLUS appropriate measuresyou can take to reduce, eliminate, or accommodate expectedfailures Characterize materials and processes by the key controllablefactors, such as types and levels of defects, variations inmaterial properties and dimensions, and the manufacturing andassembly processes involved Use experiment, step-stress, and accelerated methods to ensureoptimum design before production begins Detailed design guidelines for substrate...wire and wire, tapeautomated, and flip-chip bonding...element attachment and case,lead, lead and lid seals—incorporating dimensional andgeometric configurations of package elements, manufacturing andassembly conditions, materials selection, and loadingconditions—round out this guide's comprehensive coverage.Detailed guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions--round out this guide'scomprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS —Allan D. Kraus,Robert Hannemann and Michael Pecht For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT —Michael G. Pecht This comprehensive, fundamentals first handbook outlines thesoldering methods and techniques used in the manufacture ofmicroelectronic chips and electronic circuit boards. In a clear,easy-to-access format, the book discusses: soldering processes andclassification; the material dynamics of heat soldering whenassembling differing materials; wave and reflow soldering;controlling contamination during manufacturing cleanings;techniques for assuring reliability and quality control duringmanufacturing; rework, repair, and manual assembly; the modernassembly / repair station; and more. The book also provides clearguidelines on assembly techniques as well as an appendix of varioussolder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.

Electronic Materials Handbook

Author:
Publisher: ASM International
ISBN: 9780871702852
Size: 30.47 MB
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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.