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Force Sensors For Microelectronic Packaging Applications

Author: Jürg Schwizer
Publisher: Springer Science & Business Media
ISBN: 3540269452
Size: 80.51 MB
Format: PDF, ePub, Docs
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Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement technologies that allow for in situ and real-time examination of physical processes during the packaging process or during subsequent reliability tests. The measurement system presented here makes possible measurements at formerly inaccessible packaging interconnects. For the first time it becomes possible to describe the wire-bonding process window in terms of the physical forces at the contact zone instead of the applied machine settings. This is significant for a deeper understanding and future development of these packaging processes. Applications of the sensor in the field of wire bonding and flip-chip characterization are also illustrated. The reader will gain much insight into the important field of interconnection technology in semiconductor packaging.

Fast Simulation Of Electro Thermal Mems

Author: Tamara Bechtold
Publisher: Springer Science & Business Media
ISBN: 3540346139
Size: 12.50 MB
Format: PDF, Mobi
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This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.

Capillary Forces In Microassembly

Author: Pierre Lambert
Publisher: Springer Science & Business Media
ISBN: 0387710892
Size: 75.17 MB
Format: PDF, ePub
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Capillary Forces in Microassembly discusses the use of capillary forces as a gripping principle in microscale assembly. Clearly written and well-organized, this text brings together physical concepts at the microscale with practical applications in micromanipulation. Throughout this work, the reader will find a review of the existing gripping principles, elements to model capillary forces as well as descriptions of the simulation and experimental test bench developed to study the design parameters. Using well-known concepts from surface science (such as surface tension, capillary effects, wettability, and contact angles) as inputs to mechanical models, the amount of effort required to handle micro-components is then predicted. Researchers and engineers involved in micromanipulation and precision assembly will find this a highly useful reference for microassembly system design and analysis.

Thermal Transport For Applications In Micro Nanomachining

Author: Basil T. Wong
Publisher: Springer Science & Business Media
ISBN: 3540736077
Size: 47.56 MB
Format: PDF
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Beginning with an overview of nanomachining, this monograph introduces the relevant concepts from solid-state physics, thermodynamics, and lattice structures. It then covers modeling of thermal transport at the nanoscale and details simulations of different processes relevant to nanomachining. The final chapter summarizes the important points and discusses directions for future work to improve the modeling of nanomachining.

Microjoining And Nanojoining

Author: Y. Zhou
Publisher: CRC Press
ISBN:
Size: 15.69 MB
Format: PDF, Kindle
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Many recent advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems. Microjoining has been closely associated with the evolution of microelectronic packaging, but actually covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. Part 1 reviews the basics of microjoining, including solid-state bonding and fusion microwelding. Part 2 covers microjoining and nanojoining processes, such as bonding mechanisms and metallurgy, process development and optimization, thermal stresses and distortion, positioning and fixturing, sensing, and numerical modelling. Part 3 discusses microjoining of materials such as plastics, ceramics, metals and advanced materials such as shape memory alloys and nanomaterials. The book also discusses applications of microjoining such as joining superconductors, the manufacture of medical devices and the sealing of solid oxide fuel cells. This book provides a comprehensive overview of the fundamental aspects of microjoining processes and techniques. It will be a valuable reference for production engineers, designers and researchers using or studying microjoining technologies in such industries as microelectronics and biomedical engineering. Features

Mechanical Microsensors

Author: Miko Elwenspoek
Publisher: Springer Science & Business Media
ISBN: 3662043211
Size: 61.14 MB
Format: PDF
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This book on mechanical microsensors is based on a course organized by the Swiss Foundation for Research in Microtechnology (FSRM) in Neuchatel, Swit zerland, and developed and taught by the authors. Support by FSRM is herewith gratefully acknowledged. This book attempts to serve two purposes. First it gives an overview on me chanical microsensors (sensors for pressure, force, acceleration, angular rate and fluid flow, realized by silicon micromachining). Second, it serves as a textbook for engineers to give them a comprehensive introduction on the basic design issues of these sensors. Engineers active in sensor design are usually educated either in electrical engineering or mechanical engineering. These classical educa tional pro grams do not prepare the engineer for the challenging task of sensor design since sensors are instruments typically bridging the disciplines: one needs a rather deep understanding of both mechanics and electronics. Accordingly, the book contains discussion of the basic engineering sciences relevant to mechanical sensors, hopefully in a way that it is accessible for all colours of engineers. Engi rd th neering students in their 3 or 4 year should have enough knowledge to be able to follow the arguments presented in this book. In this sense, this book should be useful as textbook for students in courses on mechanical microsensors (as is CUf rently being done at the University ofTwente).

4m 2006 Second International Conference On Multi Material Micro Manufacture

Author: Stefan Dimov
Publisher: Elsevier
ISBN: 9780080466293
Size: 78.51 MB
Format: PDF, Kindle
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4M 2006 - Second International Conference on Multi-Material Micro Manufacture covers the latest state-of-the-art research results from leading European researchers in advanced micro technologies for batch processing of metals, polymers, and ceramics, and the development of new production platforms for micro systems-based products. These contributions are from leading authors at a platform endorsed and funded by the European Union R&D community, as well as leading universities, and independent research and corporate organizations. Contains authoritative papers that reflect the latest developments in micro technologies and micro systems-based products

Mechanisms And Mechanical Devices Sourcebook 5th Edition

Author: Neil Sclater
Publisher: McGraw Hill Professional
ISBN: 0071704426
Size: 13.99 MB
Format: PDF, Mobi
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THOUSANDS OF DRAWINGS AND DESCRIPTIONS COVER INNOVATIONS IN MECHANICAL ENGINEERING Fully revised throughout, this abundantly illustrated reference describes proven mechanisms and mechanical devices. Each illustration represents a design concept that can easily be recycled for use in new or modified mechanical, electromechanical, or mechatronic products. Tutorials on the basics of mechanisms and motion control systems introduce you to those subjects or act as a refresher. Mechanisms and Mechanical Devices Sourcebook, Fifth Edition, contains new chapters on mechanisms for converting renewable energy into electrical power, 3D digital prototyping and simulation, and progress in MEMS and nanotechnology based on carbon nanotubes. A new chapter on stationary and mobile robots describes their roles in industry, science, national defense, and medicine. The latest advances in rapid prototyping are also discussed. This practical guide will get you up to speed on many classical mechanical devices as well as the hot new topics in mechanical engineering. COMPREHENSIVE INDEX MAKES IT EASY TO FIND SUBJECTS OF INTEREST GLOSSARIES OF TERMS ON: CAMS, GEARS, MECHANICS, MOTION CONTROL, ROBOTICS, WIND TURBINES, PUMPS, AND 3D DIGITAL PROTOTYPING AND SIMULATION COVERAGE OF MOBILE ROBOTS THAT EXPLORE MARS, PERFORM MILITARY DUTIES AND PUBLIC SERVICE, HANDLE AUTOMATED DELIVERY, CONDUCT SURVEILLANCE FROM THE AIR, AND SEARCH UNDER THE SEA DETAILS ON THE MECHANISMS IN RENEWABLE-ENERGY AND WIND-TURBINE AND SOLAR-THERMAL FARMS AND WAVE-MOTION POWER PLANTS Mechanisms and Mechanical Devices Sourcebook, Fifth Edition, covers: Basics of mechanisms * Motion control systems * New stationary and mobile robots * New mechanisms for renewable power generation * Drives and mechanisms with linkages, gears, cams, genevas, and ratchets * Clutches and brakes * Latching, fastening, and clamping devices and mechanisms * Chains, belts, springs, and screws * Shaft couplings and connections * Motion-specific devices * Packaging, conveying, handling, and safety mechanisms and machines * Torque, speed, tension, and limit control systems * Instruments and controls: pneumatic, hydraulic, electric, and electronic * New 3D digital prototyping and simulation techniques * New rapid prototyping methods * New directions in mechanical engineering