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Handbook Of Quality Integrated Circuit Manufacturing

Author: Robert Zorich
Publisher: Academic Press
ISBN: 0323140556
Size: 64.95 MB
Format: PDF, ePub, Docs
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Here is a comprehensive practical guide to entire wafer fabrication process from A to Z. Written by a practicing process engineer with years of experience, this book provides a thorough introduction to the complex field of IC manufacturing, including wafer area layout and design, yield optimization, just-in-time management systems, statistical quality control, fabrication equipment and its setup, and cleanroom techniques. In addition, it contains a wealth of information on common process problems: How to detect them, how to confirm them, and how to solve them. Whether you are a new enginner or technician just entering the field, a fabrication manager looking for ways to improve quality and production, or someone who would just like to know more about IC manufacturing, this is the book you're looking for. Provides a readable, practical overview of the entire wafer fabrication process for new engineers and those just entering this complex field Enables engineers and managers to improve production, raise quality levels, and solve problems that commonly occur in the fabrication process Presents the latest techniques and gives special attention to Japanese IC manufacturing techniques, showing how they obtain outstanding quality

Microelectronics Manufacturing Diagnostics Handbook

Author: Abraham Landzberg
Publisher: Springer Science & Business Media
ISBN: 1461520290
Size: 17.59 MB
Format: PDF
View: 128
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The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Computational Intelligence In Manufacturing Handbook

Author: Jun Wang
Publisher: CRC Press
ISBN: 1420041932
Size: 34.96 MB
Format: PDF, ePub
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Despite the large volume of publications devoted to neural networks, fuzzy logic, and evolutionary programming, few address the applications of computational intelligence in design and manufacturing. Computational Intelligence in Manufacturing Handbook fills this void as it covers the most recent advances in this area and state-of-the-art applications. This comprehensive handbook contains an excellent balance of tutorials and new results, that allows you to: obtain current information understand technical details assess research potentials, and define future directions of the field Manufacturing applications play a leading role in progress, and this handbook gives you a ready reference to guide you easily through these developments.

Opto Mechatronic Systems Handbook

Author: Hyungsuck Cho
Publisher: CRC Press
ISBN: 1420040693
Size: 35.84 MB
Format: PDF, ePub, Docs
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Opto-mechatronics-the fusion of optical and mechatronic technologies-has been integral in the evolution of machines, systems, and products that are smaller and more precise, more intelligent, and more autonomous. For the technology to reach its full potential, however, engineers and researchers from many disciplines must learn to work together through every phase of system development. To date, little effort has been expended, either in practice or in the literature, to eliminate the boundaries that exist between the optics and mechatronics communities. The Opto-Mechatronics Systems Handbook is the first step in that direction. Richly illustrated and featuring contributions from an international panel of experts, it meets three essential objectives: Ö Present the definitions, fundamentals, and applications of the technology Ö Provide a multidisciplinary perspective that shows how optical systems and devices can be integrated with mechatronic systems at all stages, from conceptualization to design and manufacturing Ö Demonstrate the roles and synergistic effects of optical systems in overall system performance Along with his fresh approach and systems perspective, the editor has taken care to address real cutting-edge technologies, including precision opto-mechatronic systems, intelligent robots, and opto-microsensors. Ultimately, the Opto-Mechatronics Systems Handbook provides readers with the technological foundation for developing further innovative products and systems.

Integrated Circuit Failure Analysis

Author: Friedrich Beck
Publisher: John Wiley & Sons
ISBN: 9780471974017
Size: 55.64 MB
Format: PDF, ePub
View: 515
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Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

Newnes Electronics Assembly Handbook

Author: Keith Brindley
Publisher: Elsevier
ISBN: 1483102513
Size: 11.53 MB
Format: PDF, ePub
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Newnes Electronics Assembly Handbook: Techniques, Standards and Quality Assurance focuses on the aspects of electronic assembling. The handbook first looks at the printed circuit board (PCB). Base materials, basic mechanical properties, cleaning of assemblies, design, and PCB manufacturing processes are then explained. The text also discusses surface mounted assemblies and packaging of electromechanical assemblies, as well as the soldering process. Requirements for the soldering process; solderability and protective coatings; cleaning of PCBs; and mass solder/component reflow soldering are described. The book also underscores testing for quality. Reliability, component parts testing, production processes, and the packaged and unpackaged assemblies are discussed. The text also examines standardization of electronics manufacture. Reference to standards, standards of organizations and bodies, assessed quality of companies, and setting up of company standards are considered. The book also discusses the process of selling to the Ministry of Defense. Procurement executive, quality assurance, and procurement executive policies and procedures are clarified. The handbook is a helpful reference for readers wanting to study the processes involved in electronic assembling.

Integrated Circuit Hybrid And Multichip Module Package Design Guidelines

Author: Michael Pecht
Publisher: John Wiley & Sons
ISBN: 9780471594468
Size: 44.85 MB
Format: PDF, ePub, Docs
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Circuit designers, packaging engineers, printed board fabricators,and procurement personnel will find this book's microelectronicpackage design-for-reliability guidelines and approaches essentialfor achieving their life-cycle, cost-effectiveness, and on-timedelivery goals. Its uniquely organized, time-phased approach to design,development, qualification, manufacture, and in-service managementshows you step-by-step how to: Define realistic system requirements in terms of missionprofile, operating life, performance expectations, size, weight,and cost Define the system usage environment so that all operating,shipping, and storage conditions, including electrical, thermal,radiation, and mechanical loads, are assessed using realisticdata Identify potential failure modes, sites, mechanisms, andarchitecture-stress interactions—PLUS appropriate measuresyou can take to reduce, eliminate, or accommodate expectedfailures Characterize materials and processes by the key controllablefactors, such as types and levels of defects, variations inmaterial properties and dimensions, and the manufacturing andassembly processes involved Use experiment, step-stress, and accelerated methods to ensureoptimum design before production begins Detailed design guidelines for substrate...wire and wire, tapeautomated, and flip-chip bonding...element attachment and case,lead, lead and lid seals—incorporating dimensional andgeometric configurations of package elements, manufacturing andassembly conditions, materials selection, and loadingconditions—round out this guide's comprehensive coverage.Detailed guidelines for substrate...wire and wire, tape automated,and flip-chip bonding...element attachment and case, lead, lead andlid seals--incorporating dimensional and geometric configurationsof package elements, manufacturing and assembly conditions,materials selection, and loading conditions--round out this guide'scomprehensive coverage. of related interest... PHYSICAL ARCHITECTURE OF VLSI SYSTEMS —Allan D. Kraus,Robert Hannemann and Michael Pecht For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines:basic chip and computer architecture; design and layout;interassembly and interconnections; cooling scheme; materialsselection, including ceramics, glasses, and metals; stress,vibration, and acoustics; and manufacturing and assemblytechnology. 1994 (0-471-53299-1) pp. SOLDERING PROCESSES AND EQUIPMENT —Michael G. Pecht This comprehensive, fundamentals first handbook outlines thesoldering methods and techniques used in the manufacture ofmicroelectronic chips and electronic circuit boards. In a clear,easy-to-access format, the book discusses: soldering processes andclassification; the material dynamics of heat soldering whenassembling differing materials; wave and reflow soldering;controlling contamination during manufacturing cleanings;techniques for assuring reliability and quality control duringmanufacturing; rework, repair, and manual assembly; the modernassembly / repair station; and more. The book also provides clearguidelines on assembly techniques as well as an appendix of varioussolder equipment manufacturers. 1993 (0-471-59167-X) 312 pp.

The Electrical Engineering Handbook Second Edition

Author: Richard C. Dorf
Publisher: CRC Press
ISBN: 9781420049763
Size: 28.99 MB
Format: PDF, Mobi
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In 1993, the first edition of The Electrical Engineering Handbook set a new standard for breadth and depth of coverage in an engineering reference work. Now, this classic has been substantially revised and updated to include the latest information on all the important topics in electrical engineering today. Every electrical engineer should have an opportunity to expand his expertise with this definitive guide. In a single volume, this handbook provides a complete reference to answer the questions encountered by practicing engineers in industry, government, or academia. This well-organized book is divided into 12 major sections that encompass the entire field of electrical engineering, including circuits, signal processing, electronics, electromagnetics, electrical effects and devices, and energy, and the emerging trends in the fields of communications, digital devices, computer engineering, systems, and biomedical engineering. A compendium of physical, chemical, material, and mathematical data completes this comprehensive resource. Every major topic is thoroughly covered and every important concept is defined, described, and illustrated. Conceptually challenging but carefully explained articles are equally valuable to the practicing engineer, researchers, and students. A distinguished advisory board and contributors including many of the leading authors, professors, and researchers in the field today assist noted author and professor Richard Dorf in offering complete coverage of this rapidly expanding field. No other single volume available today offers this combination of broad coverage and depth of exploration of the topics. The Electrical Engineering Handbook will be an invaluable resource for electrical engineers for years to come.

Computer Integrated Manufacturing Handbook

Author: V.D. Hunt
Publisher: Springer Science & Business Media
ISBN: 1461315778
Size: 50.99 MB
Format: PDF, ePub, Docs
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Manufacturing has entered the early stages of a revolutionary period caused by the convergence of three powerful trends: • The rapid advancement and spread of manufacturing capabilities worldwide has created intense competition on a global scale. • The emergence of advanced manufacturing technologies is dramati cally changing both the products and processes of modern manufac turing. • Changes in traditional management and labor practices, organiza tional structures, and decision-making criteria represent new sources of competitiveness and introduce new strategic opportunities. These trends are interrelated and their effects are already being felt by the u.s. manufacturing community. Future competitiveness for manu facturers worldwide will depend on their response to these trends. Based on the recent performance of u.s. manufacturers, efforts to respond to the challenges posed by new competition, technology, and managerial opportunities have been slow and inadequate. Domestic markets that were once secure have been assailed by a growing number of foreign competitors producing high quality goods at low prices. In a number of areas, such as employment, capacity utilization, research and development expenditures, and capital investment, trends in u.s. manufacturing over the last decade have been unfavorable or have not kept pace with major foreign competitors, such as Japan. There is substantial evidence that many u.s. manufacturers have neglected the manufacturing function, have overemphasized product development at the expense of process improvements, and have not begun to make the adjustments that will be necessary to be competitive.