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The Finite Element Method For Three Dimensional Thermomechanical Applications

Author: Guido Dhondt
Publisher: John Wiley & Sons
ISBN: 0470857625
Size: 17.14 MB
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Though many 'finite element' books exist, this book provides a unique focus on developing the method for three-dimensional, industrial problems. This is significant as many methods which work well for small applications fail for large scale problems, which generally: are not so well posed introduce stringent computer time conditions require robust solution techniques. Starting from sound continuum mechanics principles, derivation in this book focuses only on proven methods. Coverage of all different aspects of linear and nonlinear thermal mechanical problems in solids are described, thereby avoiding distracting the reader with extraneous solutions paths. Emphasis is put on consistent representation and includes the examination of topics which are not frequently found in other texts, such as cyclic symmetry, rigid body motion and nonlinear multiple point constraints. Advanced material formulations include anisotropic hyperelasticity, large strain multiplicative viscoplasticity and single crystal viscoplasticity. Finally, the methods described in the book are implemented in the finite element software CalculiX, which is freely available (; the GNU General Public License applies). Suited to industry practitioners and academic researchers alike, The Finite Element Method for Three-Dimensional Thermomechanical Applications expertly bridges the gap between continuum mechanics and the finite element method.

Umformtechnik Handbuch F R Industrie Und Wissenschaft

Author: Kurt Lange
Publisher: Springer-Verlag
ISBN: 3642580475
Size: 55.31 MB
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Falls Sie Wissenschaftler oder Praktiker auf dem Gebiet der Umformtechnik sind, so stehen die ersten drei Bände dieser umfassenden und detaillierten Standardreferenz wahrscheinlich schon in Ihrem Regal. Der vierte Band komplettiert das Werk. Auch er wurde von führenden Industriepraktikern und Wissenschaftlern unter der Federführung eines der renommiertesten Fachleute auf diesem Gebiet verfaßt.


Author: Manfred Meissner
Publisher: Springer-Verlag
ISBN: 3642391230
Size: 20.41 MB
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Behandelt werden die Berechnungsgrundlagen für den Einsatz von Federn aus metallischen Werkstoffen. Das Buch umfasst Wärme- sowie Oberflächenbehandlung, Eigenspannungen und Dauerfestigkeiten, die entscheidend für die Qualität sind. Die Autoren beschreiben auch grundsätzliche Verfahren und Probleme der Federnherstellung. Zahlreiche Anwendungs- und Berechnungsbeispiele ergänzen die Ausführungen. Aktualisiert wurde diese Auflage hinsichtlich der EU- bzw. DIN-Normen sowie der Ausführungen zur Anwendung moderner Berechnungssoftware für den Federentwurf und die Simulation des Betriebsverhaltens von Federn und Federanordnungen. Ebenso werden Ansätze zur FEM-Simulation der Herstellung von Schraubendruckfedern und Ergebnisse zum damit einhergehenden Eigenspannungsaufbau behandelt. Neue und bisher nicht erfasste Federnarten und deren Werkstoffe werden beschrieben. Ergänzt wurde ein Kapitel zu tribologischen Beanspruchungen von Federn.

Finite Element Plasticity And Metalforming Analysis

Author: G. W. Rowe
Publisher: Cambridge University Press
ISBN: 9780521017312
Size: 46.82 MB
Format: PDF
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This book is concerned with describing a computer based technique for aiding the optimisation of metalforming processes. The methods described in this text should enable tool and product designers to reduce development lead times for the introduction of new products, to optimise the process and to help improve the quality and reliability of products.

The Finite Element Method And Applications In Engineering Using Ansys

Author: Erdogan Madenci
Publisher: Springer
ISBN: 1489975500
Size: 21.73 MB
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This textbook offers theoretical and practical knowledge of the finite element method. The book equips readers with the skills required to analyze engineering problems using ANSYS®, a commercially available FEA program. Revised and updated, this new edition presents the most current ANSYS® commands and ANSYS® screen shots, as well as modeling steps for each example problem. This self-contained, introductory text minimizes the need for additional reference material by covering both the fundamental topics in finite element methods and advanced topics concerning modeling and analysis. It focuses on the use of ANSYS® through both the Graphics User Interface (GUI) and the ANSYS® Parametric Design Language (APDL). Extensive examples from a range of engineering disciplines are presented in a straightforward, step-by-step fashion. Key topics include: • An introduction to FEM • Fundamentals and analysis capabilities of ANSYS® • Fundamentals of discretization and approximation functions • Modeling techniques and mesh generation in ANSYS® • Weighted residuals and minimum potential energy • Development of macro files • Linear structural analysis • Heat transfer and moisture diffusion • Nonlinear structural problems • Advanced subjects such as submodeling, substructuring, interaction with external files, and modification of ANSYS®-GUI Electronic supplementary material for using ANSYS® can be found at This convenient online feature, which includes color figures, screen shots and input files for sample problems, allows for regeneration on the reader’s own computer. Students, researchers, and practitioners alike will find this an essential guide to predicting and simulating the physical behavior of complex engineering systems."

Theoretical Experimental And Numerical Contributions To The Mechanics Of Fluids And Solids

Author: Paul Mansour Naghdi
Publisher: Springer Science & Business Media
ISBN: 9783764351397
Size: 79.55 MB
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ZAMP special issue, Vol. 46 This is a comprehensive and up-to-date collection of papers on the mechanics of fluids and solids by leading researchers. It encompasses theoretical, experimental and numerical work on a variety of topics, including nonlinear elasticity, plastici- ty, dynamics, water waves, and turbulence. The collection is published in celebration of Professor Paul M. Naghdi's lifelong contributions to the field of mechanics. It will be of interest to graduate students and researchers in all branches of continuum mechanics.

The Simulation Of Thermomechanically Induced Stress In Plastic Encapsulated Ic Packages

Author: Gerard Kelly
Publisher: Springer Science & Business Media
ISBN: 9780792384854
Size: 63.40 MB
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This book is motivated by the need to understand and predict the complex stress distributions, transfer mechanisms, warpage, and potential failures arising from the encapsulation of devices in plastic. Failures like delaminations, package cracking, and metal shift occur due to the build-up of residual stress and warpage in the packages because of the TCE mismatch between the package materials as the package cools from its molding temperature to room temperature. The correct use of finite element tools for these problems is emphasised. F.E. techniques are used to predict the internal package stress distribution and help explain the stress transfer mechanism between the die, die paddle, and plastic after molding. Out-of-plane shear stress components are shown to be responsible for experimentally observed metal shift patterns on the die surface. Delaminations dramatically alter the internal stress state within a package, increasing the tensile stress in the plastic and so the likelihood of plastic cracks, the stress on wire bonds, and the incidence of wire bond failure. The application of F.E. techniques to predict the post-mold warpage of both thermally enhanced PQFPs and TQFPs is described. Simulations of a thermally enhanced PQFP warpage based on standard modelling assumptions alone fail to predict either the magnitude or its direction correctly. The modelling assumptions need to be modified to include the chemical shrinkage of the molding compound to enable accurate predictions of package warpage to be made, particularly when the packages are asymmetric in structure. Microsystem packaging in both plastic and 3D package body styles is reviewed. Although microsystem packaging is derived from IC packaging, additional requirements for microsystems, not common to IC packaging are highlighted. The assembly stresses on a novel microsystem, incorporating a micromachined silicon membrane pump integrated into a 3D plastic encapsulated vertical multichip module package (MCM-V), are analysed.

Thermal Process Modeling 2014

Author: B. Lynn Ferguson, Robert Goldstein, Scott MacKenzie, and Rozalia Papp
Publisher: ASM International
ISBN: 1627080686
Size: 36.56 MB
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Thermal processes are key manufacturing steps in producing durable and useful products, with solidification, welding, heat treating, and surface engineering being primary steps. These papers represent the latest state-of-the-art in thermal process modeling. The breadth of topics covers the depth of the industry.

Advanced Research On Electronic Commerce Web Application And Communication

Author: Gang Shen
Publisher: Springer Science & Business Media
ISBN: 3642203698
Size: 35.55 MB
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The two-volume set CCIS 143 and CCIS 144 constitutes the refereed proceedings of the International Conference on Electronic Commerce, Web Application, and Communication, ECWAC 2011, held in Guangzhou, China, in April 2011. The 148 revised full papers presented in both volumes were carefully reviewed and selected from a large number of submissions. Providing a forum for engineers, scientists, researchers in electronic commerce, Web application, and communication fields, the conference will put special focus also on aspects such as e-business, e-learning, and e-security, intelligent information applications, database and system security, image and video signal processing, pattern recognition, information science, industrial automation, process control, user/machine systems, security, integrity, and protection, as well as mobile and multimedia communications.