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Advanced Cmos Process Technology

Author: J Pimbley
Publisher: Elsevier
ISBN: 0323156800
Size: 33.88 MB
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Advanced CMOS Process Technology is part of the VLSI Electronics Microstructure Science series. The main topic of this book is complementary metal-oxide semiconductor or CMOS technology, which plays a significant part in the electronics systems. The topics covered in this book range from metallization, isolation techniques, reliability, and yield. The volume begins with an introductory chapter that discusses the microelectronics revolution of the 20th century. Then Chapter 2 puts focus on the CMOS devices and circuit background, discussing CMOS capacitors and field effect transistors. Metallization topics and concepts are covered in Chapter 3, while isolation techniques are tackled in Chapter 4. Long-term reliability of CMOS is the topic covered in Chapter 5. Finally, the ability of semiconductor technology to yield circuits is discussed in Chapter 6. The book is particularly addressed to engineers, scientists, and technical managers.

Microelectronics Manufacturing Diagnostics Handbook

Author: Abraham Landzberg
Publisher: Springer Science & Business Media
ISBN: 1461520290
Size: 48.25 MB
Format: PDF
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The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.

Application Specific Integrated Circuit Asic Technology

Author: Norman G. Einspruch
Publisher:
ISBN: 9780122341236
Size: 10.53 MB
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V. 1-5. [without special title] -- v. 6. Materials and process characterization -- v. 7. [without special title] -- v. 8. Plasma processing for VLSI -- v. 9. [without special title] -- v. 10. Surface and interface effects in VLSI -- v. 11. GaAs microelectronics -- v. 12. Silicon materials -- v. 13. Metal-semiconductor contacts and devices -- v. 14. VLSI design -- v. 15. VLSI metallization -- v. 16. Lithography for VLSI -- v. 17. VLSI in medicine -- v. 18. Advanced MOS device physics -- v. 19. Advanced CMOS process technology -- 20. VLSI and computer architecture -- v. 21. Beam processing technologies -- v. 22. VLSI reliability -- v. 23. Application specific integrated circuit (ASIC) technology -- v. 24. Heterostructures and quantum devices.

Wireless Sensor Networks

Author: Edgar H. Callaway, Jr.
Publisher: CRC Press
ISBN: 9780203500705
Size: 14.38 MB
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Because they provide practical machine-to-machine communication at a very low cost, the popularity of wireless sensor networks is expected to skyrocket in the next few years, duplicating the recent explosion of wireless LANs. Wireless Sensor Networks: Architectures and Protocols describes how to build these networks, from the layers of the communication protocol through the design of network nodes. This overview summarizes the multiple applications of wireless sensor networks, then discusses network device design and the requirements that foster the successful performance of these applications. The book discusses factors affecting network design, including the partitioning of node functions into integrated circuits, low power system design, power sources, and the interaction between antenna selection and product design. It presents design techniques that improve electromagnetic compatibility and reduce damage from electrostatic discharge. The text also describes the design features of the wireless devices themselves, presenting a thorough analysis of the technology that engineers and students need to design and build the many future applications that will incorporate wireless sensor networks.

Predictive Technology Model For Robust Nanoelectronic Design

Author: Yu Cao
Publisher: Springer Science & Business Media
ISBN: 9781461404453
Size: 35.25 MB
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Predictive Technology Model for Robust Nanoelectronic Design explains many of the technical mysteries behind the Predictive Technology Model (PTM) that has been adopted worldwide in explorative design research. Through physical derivation and technology extrapolation, PTM is the de-factor device model used in electronic design. This work explains the systematic model development and provides a guide to robust design practice in the presence of variability and reliability issues. Having interacted with multiple leading semiconductor companies and university research teams, the author brings a state-of-the-art perspective on technology scaling to this work and shares insights gained in the practices of device modeling.

Power And Timing Modelling For Performance Of Integrated Circuits

Author: Daniel Auvergne
Publisher:
ISBN:
Size: 76.41 MB
Format: PDF
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"Fast advances in technology raise new challenges to physical design of integrated circuits and systems. High circuit density and increasing importance of battery-operated applications stress emphasis in system performances not only timing constraints but also power constraints to be considered at every stage of physical design. Regularly decreasing feature size leads to dense circuits in which high complexity combined with highly limited power dissipation must not sacrifice computational knowledge. The objective of this book is to provide a summary of important more recent research in this rapidly changing field. A major emphasis is put on modelling and characterisation mehtods allowing performance-driven design for advanced technologies"--Back cover.

Proceedings Of The Multi Conference 2011

Author: Himanshu B. Soni
Publisher: Universal-Publishers
ISBN: 1612330029
Size: 23.83 MB
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The International Conference on Signals, Systems and Automation (ICSSA 2011) aims to spread awareness in the research and academic community regarding cutting-edge technological advancements revolutionizing the world. The main emphasis of this conference is on dissemination of information, experience, and research results on the current topics of interest through in-depth discussions and participation of researchers from all over the world. The objective is to provide a platform to scientists, research scholars, and industrialists for interacting and exchanging ideas in a number of research areas. This will facilitate communication among researchers in different fields of Electronics and Communication Engineering. The International Conference on Intelligent System and Data Processing (ICISD 2011) is organized to address various issues that will foster the creation of intelligent solutions in the future. The primary goal of the conference is to bring together worldwide leading researchers, developers, practitioners, and educators interested in advancing the state of the art in computational intelligence and data processing for exchanging knowledge that encompasses a broad range of disciplines among various distinct communities. Another goal is to promote scientific information interchange between researchers, developers, engineers, students, and practitioners working in India and abroad.