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Chemical Mechanical Planarization Of Semiconductor Materials

Author: M.R. Oliver
Publisher: Springer Science & Business Media
ISBN: 3662062348
Size: 70.19 MB
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This book contains a comprehensive review of CMP (Chemical-Mechanical Planarization) technology, one of the most exciting areas in the field of semiconductor technology. It contains detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered. Polishing tools and consumables are also covered. The leading edge issues of damascene and new dielectrics as well as slurryless technology are discussed.

Wafer Bonding

Author: Marin Alexe
Publisher: Springer Science & Business Media
ISBN: 9783540210498
Size: 73.84 MB
Format: PDF
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During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Predictive Simulation Of Semiconductor Processing

Author: Jaroslaw Dabrowski
Publisher: Springer Science & Business Media
ISBN: 9783540204817
Size: 71.87 MB
Format: PDF, ePub, Mobi
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Predictive Simulation of Semiconductor Processing enables researchers and developers to extend the scaling range of semiconductor devices beyond the parameter range of empirical research. It requires a thorough understanding of the basic mechanisms employed in device fabrication, such as diffusion, ion implantation, epitaxy, defect formation and annealing, and contamination. This book presents an in-depth discussion of our current understanding of key processes and identifies areas that require further work in order to achieve the goal of a comprehensive, predictive process simulation tool.

Advances In Chemical Mechanical Planarization Cmp

Author: Suryadevara Babu
Publisher: Woodhead Publishing
ISBN: 0081002181
Size: 44.31 MB
Format: PDF, Kindle
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Advances in Chemical Mechanical Planarization (CMP) provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The technology has grown to encompass the removal and planarization of multiple metal and dielectric materials and layers both at the device and the metallization levels, using different tools and parameters, requiring improvements in the control of topography and defects. This important book offers a systematic review of fundamentals and advances in the area. Part One covers CMP of dielectric and metal films, with chapters focusing on the use of particular techniques and processes, and on CMP of particular various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. Part Two addresses consumables and process control for improved CMP, and includes chapters on the preparation and characterization of slurry, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes, and approaches for defection characterization, mitigation, and reduction. Considers techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for particular materials Addresses consumables and process control for improved CMP

Advances In Chemical Mechanical Polishing

Author: Duane S. Boning
Publisher:
ISBN:
Size: 43.38 MB
Format: PDF, ePub
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While now in widespread use in integrated circuit fabrication, chemical-mechanical polishing (CMP) is also starting to appear in a surprisingly wide range of applications, with a growing variety of processes and technologies. Applications include planarization of surface topography, "polish back" or creation of in-laid materials in other structures, and reduction of surface roughness (e.g., for 3D wafer bonding and substrate engineering). This volume, the seventh in an annual series on CMP, presents new advances in fundamental understanding, development, and applications of CMP. CMP of both conventional and nonconventional materials are discussed. Conventional materials polished using CMP include silicon, oxides and nitrides, polysilicon, and other insulating films, as well as copper, tungsten, barrier films, and other metal films. Nonconventional materials include those of increasing importance in advanced semiconductor, MEMS, and nanotechnologies, such as low-k dielectrics and polymer, nickel, and ruthenium films. CMP in IC fabrication continues to pose substantial problems-for virgin silicon wafer preparation, shallow-trench isolation (STI) structures, and poly or other deeptrench structure formation, as well as copper and low-k metal interconnect. New developments in CMP pads (grooving, fixed abrasive, ceramic coated) and slurries (SiO2, Al2O3, CeO2, coated or doped, polymer or BN as abrasive) are presented. Novel polishing methods and equipment such as controlled high-pressure atmosphere, water jet conditioning or novel polishing head designs are described. Advances in CMP process understanding and modeling are also highlighted.

Design For Advanced Manufacturing Technologies And Processes

Author: LaRoux K. Gillespie
Publisher: McGraw Hill Professional
ISBN: 1259587460
Size: 12.68 MB
Format: PDF, Docs
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Cutting-edge coverage of the new processes, materials, and technologies that are revolutionizing the manufacturing industry Expertly edited by a past president of the Society of Manufacturing Engineers, this state-of-the-art resource picks up where the bestselling Design for Manufacturability Handbook left off. Within its pages, readers will find detailed, clearly written coverage of the materials, technologies, and processes that have been developed and adopted in the manufacturing industry over the past sixteen years. More than this, the book also includes hard-to-find technical guidance and application information that can be used on the job to actually apply these cutting-edge processes and technologies in a real-world setting. Essential for manufacturing engineers and designers, Design for Advanced Manufacturing is enhanced by a host of international contributors, making the book a true global resource. • Information on the latest technologies and processes such as 3-D printing, nanotechnology, laser cutting, prototyping, additive manufacturing, and CAD/CAM software tools • Coverage of new materials including nano, smart, and shape-memory alloys, in steels, glass, plastics, and composites

Atomic Layer Deposition For Semiconductors

Author: Cheol Seong Hwang
Publisher: Springer Science & Business Media
ISBN: 146148054X
Size: 57.61 MB
Format: PDF
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Offering thorough coverage of atomic layer deposition (ALD), this book moves from basic chemistry of ALD and modeling of processes to examine ALD in memory, logic devices and machines. Reviews history, operating principles and ALD processes for each device.

Integrated Modeling Of Chemical Mechanical Planarization For Sub Micron Ic Fabrication

Author: Jianfeng Luo
Publisher: Springer Science & Business Media
ISBN: 3662079283
Size: 25.54 MB
Format: PDF, Kindle
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Chemical mechanical planarization, or chemical mechanical polishing as it is simultaneously referred to, has emerged as one of the critical processes in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficient and cost-effective processing have been steady. This has continued in the face of steadily decreasing feature sizes, impressive increases in wafer size and a continuing array of new materials used in devices today. There are a number of excellent existing references and monographs on CMP in circulation and we defer to them for detailed background information. They are cited in the text. Our focus here is on the important area of process mod els which have not kept pace with the tremendous expansion of applications of CMP. Preston's equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process inputs and parameters to assess impact on quality or quantity of production. We call that an "integrated model" and, more specifically, we include the important role of the mechanical elements of the process.

Electrodeposition And Surface Finishing

Author: Stojan S. Djokić
Publisher: Springer Science & Business Media
ISBN: 149390289X
Size: 36.26 MB
Format: PDF
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This volume of Modern Aspects of Electrochemistry has contributions from significant individuals in electrochemistry. This 7 chapter book discusses electrodeposition and the characterization of alloys and composite materials, the mechanistic aspects of lead electrodeposition, electrophoretic deposition of ceramic materials onto metal surfaces and the fundamentals of metal oxides for energy conversion and storage technologies. This volume also has a chapter devoted to the anodization of aluminum, electrochemical aspects of chemical and mechanical polishing, and surface treatments prior to metallization of semiconductors, ceramics, and polymers. This volume of Modern Aspects of Electrochemistry is ideal for scientists, researchers, engineers, and students interested in the latest findings in the field of electrodeposition and surface finishing.