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Foundations Of Mems

Author: Chang Liu (Ph.D.)
Publisher: Prentice Hall
ISBN: 9780131472860
Size: 41.83 MB
Format: PDF
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Foundations of MEMS is the first entry-level text of its kind for systematically teaching the specifics of MEMS to an interdisciplinary audience. Liu discusses designs, materials, and fabrication issues related to the MEMS field by employing concepts from both the electrical and mechanical engineering domains and by incorporating evolving microfabrication technology - all in a time-efficient and methodical manner. A wealth of examples and problems solidify students' understanding of abstract concepts and provide ample opportunities for practicing critical thinking.

Mems Packaging

Author: Lee Yung-cheng
Publisher: World Scientific
ISBN: 9813229373
Size: 69.73 MB
Format: PDF, Kindle
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MEMS sensors and actuators are enabling components for smartphones, AR/VR, and wearable electronics. MEMS packaging is recognized as one of the most critical activities to design and manufacture reliable MEMS. A unique challenge to MEMS packaging is how to protect moving MEMS devices during manufacturing and operation. With the introduction of wafer level capping and encapsulation processes, this barrier is removed successfully. In addition, MEMS devices should be integrated with their electronic chips with the smallest footprint possible. As a result, 3D packaging is applied to connect the devices vertically for the most effective integration. Such 3D packaging also paves the way for further heterogenous integration of MEMS devices, electronics, and other functional devices. This book consists of chapters written by leaders developing products in a MEMS industrial setting and faculty members conducting research in an academic setting. After an introduction chapter, the practical issues are covered: through-silicon vias (TSVs), vertical interconnects, wafer level packaging, motion sensor-to-CMOS bonding, and use of printed circuit board technology to fabricate MEMS. These chapters are written by leaders developing MEMS products. Then, fundamental issues are discussed, topics including encapsulation of MEMS, heterogenous integration, microfluidics, solder bonding, localized sealing, microsprings, and reliability. Contents: Introduction to MEMS Packaging (Y C Lee, Ramesh Ramadoss and Nils Hoivik)Silex's TSV Technology: Overview of Processes and MEMS Applications (Tomas Bauer and Thorbjörn Ebefors)Vertical Interconnects for High-end MEMS (Maaike M Visser Taklo and Sigurd Moe)Using Wafer-Level Packaging to Improve Sensor Manufacturability and Cost (Paul Pickering, Collin Twanow and Dean Spicer)Nasiri Fabrication Process for Low-Cost Motion Sensors in the Consumer Market (Steven Nasiri, Ramesh Ramadoss and Sandra Winkler)PCB Based MEMS and Microfluidics (Ramesh Ramadoss, Antonio Luque and Carmen Aracil)Single Wafer Encapsulation of MEMS Resonators (Janna Rodriguez and Thomas Kenny)Heterogeneous Integration and Wafer-Level Packaging of MEMS (Masayoshi Esashi and Shuji Tanaka)Packaging of Membrane-Based Polymer Microfluidic Systems (Yu-Chuan Su)Wafer-Level Solder Bonding by Using Localized Induction Heating (Hsueh-An Yang, Chiung-Wen Lin and Weileun Fang)Localized Sealing Schemes for MEMS Packaging (Y T Cheng, Y C Su and Liwei Lin)Microsprings for High-Density Flip-Chip Packaging (Eugene M Chow and Christopher L Chua)MEMS Reliability (Chien-Ming Huang, Arvind Sai SarathiVasan, Yunhan Huang, Ravi Doraiswami, Michael Osterman and Michael Pecht) Readership: Researchers and graduate students participating in research, R&D, and manufacturing of MEMS products; professionals associated with the integration for systems represented by smartphones, AR/VR, and wearable electronics. Keywords: MEMS;Packaging;Microelectromechanical Systems;Reliability;Microstructures;Sensors;ActuatorsReview: Key Features: The book covers engineering topics critical to product development as well as research topics critical to integration for future MEMS-enabled systemsIt is a major resource for those participating in MEMS and for every professional associated with the integration for systems represented by smartphones, AR/VR and wearable electronics

Simultaneous Localization And Mapping For Mobile Robots Introduction And Methods

Author: Fernández-Madrigal, Juan-Antonio
Publisher: IGI Global
ISBN: 1466621052
Size: 47.14 MB
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As mobile robots become more common in general knowledge and practices, as opposed to simply in research labs, there is an increased need for the introduction and methods to Simultaneous Localization and Mapping (SLAM) and its techniques and concepts related to robotics. Simultaneous Localization and Mapping for Mobile Robots: Introduction and Methods investigates the complexities of the theory of probabilistic localization and mapping of mobile robots as well as providing the most current and concrete developments. This reference source aims to be useful for practitioners, graduate and postgraduate students, and active researchers alike.

Microlenses

Author: Hongrui Jiang
Publisher: CRC Press
ISBN: 1439836701
Size: 78.80 MB
Format: PDF, ePub, Docs
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Due to the development of microscale fabrication methods, microlenses are being used more and more in many unique applications, such as artificial implementations of compound eyes, optical communications, and labs-on-chips. Liquid microlenses, in particular, represent an important and growing research area yet there are no books devoted to this topic that summarize the research to date. Rectifying this deficiency, Microlenses: Properties, Fabrication and Liquid Lenses examines the recent progress in the emerging field of liquid-based microlenses. After describing how certain problems in optics can be solved by liquid microlenses, the book introduces the physics and fabrication methods involved in microlenses. It also details the facility and equipment requirements for general fabrication methods. The authors then present examples of various microlenses with non-tunable and tunable focal lengths based on different mechanisms, including: Non-tunable microlenses: Ge/SiO2 core/shell nanolenses, glass lenses made by isotropic etching, self-assembled lenses and lens arrays, lenses fabricated by direct photo-induced polymerization, lenses formed by thermally reflowing photoresist, lenses formed from inkjet printing, arrays fabricated through molding processes, and injection-molded plastic lenses Electrically tuned microlenses: liquid crystal-based lenses and liquid lenses driven by electrostatic forces, dielectrophoretic forces, electrowetting, and electrochemical reactions Mechanically tunable microlenses: thin-membrane lenses with varying apertures, pressures, and surface shapes; swellable hydrogel lenses; liquid–liquid interface lenses actuated by environmentally stimuli-responsive hydrogels; and oscillating lens arrays driven by sound waves Horizontal microlenses: two-dimensional polymer lenses, tunable and movable liquid droplets as lenses, hydrodynamically tuned cylindrical lenses, liquid core and liquid cladding lenses, air–liquid interface lenses, and tunable liquid gradient refractive index lenses The book concludes by summarizing the importance of microlenses, shedding light on future microlens work, and exploring related challenges, such as the packaging of systems, effects of gravity, evaporation of liquids, aberrations, and integration with other optical components.

Fundamentals Of Microfabrication

Author: Marc J. Madou
Publisher: CRC Press
ISBN: 9780849308260
Size: 37.19 MB
Format: PDF, Docs
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MEMS technology and applications have grown at a tremendous pace, while structural dimensions have grown smaller and smaller, reaching down even to the molecular level. With this movement have come new types of applications and rapid advances in the technologies and techniques needed to fabricate the increasingly miniature devices that are literally changing our world. A bestseller in its first edition, Fundamentals of Microfabrication, Second Edition reflects the many developments in methods, materials, and applications that have emerged recently. Renowned author Marc Madou has added exercise sets to each chapter, thus answering the need for a textbook in this field. Fundamentals of Microfabrication, Second Edition offers unique, in-depth coverage of the science of miniaturization, its methods, and materials. From the fundamentals of lithography through bonding and packaging to quantum structures and molecular engineering, it provides the background, tools, and directions you need to confidently choose fabrication methods and materials for a particular miniaturization problem. New in the Second Edition Revised chapters that reflect the many recent advances in the field Updated and enhanced discussions of topics including DNA arrays, microfluidics, micromolding techniques, and nanotechnology In-depth coverage of bio-MEMs, RF-MEMs, high-temperature, and optical MEMs. Many more links to the Web Problem sets in each chapter

Mems And Microsystems

Author: Tai-Ran Hsu
Publisher: John Wiley & Sons
ISBN: 0470083018
Size: 68.68 MB
Format: PDF, ePub, Mobi
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Technology/Engineering/Mechanical A bestselling MEMS text...now better than ever. An engineering design approach to MicroelectromechanicalSystems, MEMS and Microsystems remains the only available text tocover both the electrical and the mechanical aspects of thetechnology. In the five years since the publication of the firstedition, there have been significant changes in the science andtechnology of miniaturization, including microsystems technologyand nanotechnology. In response to the increasing needs ofengineers to acquire basic knowledge and experience in these areas,this popular text has been carefully updated, including an entirelynew section on the introduction of nanoscale engineering. Following a brief introduction to the history and evolution ofnanotechnology, the author covers the fundamentals in theengineering design of nanostructures, including fabricationtechniques for producing nanoproducts, engineering designprinciples in molecular dynamics, and fluid flows and heattransmission in nanoscale substances. Other highlights of the Second Edition include: Expanded coverage of microfabrication plus assembly andpackaging technologies The introduction of microgyroscopes, miniature microphones, andheat pipes Design methodologies for thermally actuated multilayered devicecomponents The use of popular SU-8 polymer material Supported by numerous examples, case studies, and appliedproblems to facilitate understanding and real-world application,the Second Edition will be of significant value for bothprofessionals and senior-level mechanical or electrical engineeringstudents.