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Polyimides And Other High Temperature Polymers Synthesis Characterization And Applications

Author: Kash L. Mittal
Publisher: CRC Press
ISBN: 9047424115
Size: 55.79 MB
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This volume documents the proceedings of the "Second International Symposium on Polyimides and Other High Temperature Polymers: Synthesis, Characterization and Applications, held in Newark, New Jersey, December 3-6, 2001. Polyimides possess many desirable attributes, so this class of materials has found applications in many technologies ranging from microelectronics to high temperature adhesives to membranes. This volume contains a total of 32 papers, all rigorously peer reviewed and revised before inclusion, addressing many aspects and new developments in polyimides and other high temperature polymers. The book is divided into two parts: Synthesis, Properties and Bulk Characterization and Surface Modification, Interfacial or Adhesion Aspects and Applications. The topics covered include: synthesis and characterization of a variety of polyimides; photoalignable polyimides; high-modulus poly(p-phenylenepyromellitimide) films; structure-property relationships in polyimides; aromatic benzoxazole polymers; polybenzobisthiazoles; polyimide L-B films; transport of water in high Tg polymers; surface modification of polyimides; adhesion of metal films to polyimide and other polymers; investigation of interfacial interactions between metals and polymers; polyimide film surface properties; applications of polyimides in microelectronics, as membranes for gas separation, as composite films; fabrication of thin-film transistors on polyimide films; polyimide modified with fullerenes; semicrystalline polyimides for advanced composites; and wear performance of polyetherimide composite.

Polyimides And Other High Temperature Polymers

Author: K. L. Mittal
Publisher: VSP
ISBN: 9789067643788
Size: 65.95 MB
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Annotation Containing 32 peer-reviewed papers, this volume documents the proceedings of the international symposium of the same name (held under the aegis of the Materials Science and Technology Conferences) in December of 2001. Devoted to research into high-temperature polymers, the papers are organized into sections dealing with synthesis, properties, and bulk characterization in the first half and surface modification, interfacial or adhesion aspects, and applications in the second. Annotation (c)2003 Book News, Inc., Portland, OR (

Advanced Polyimide Materials

Author: Shi-Yong Yang
Publisher: Elsevier
ISBN: 0128126418
Size: 57.30 MB
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Advanced Polyimide Materials: Synthesis, Characterization and Applications summarizes and reviews recent research and developments on several key PI materials. A wide array of PI materials are included, including high performance PI films for microelectronic fabrication and packaging, display and space applications, fiber-reinforced PI composites for structural applications in aerospace and aviation industries, and PI photoresists for integrated circuit packaging. The chemical features of PI are also described, including semi-alicyclic PIs, fluorinated PIs, phosphorous-containing PIs, silicon-containing PIs and other new varieties, providing a comprehensive overview on PI materials while also summarizing the latest research. The book serves as a valuable reference book for engineers and students working on polymer materials, microelectronics manufacturing and packaging in industries such as aerospace and aviation. Reviews the latest research, development and future prospective of polyimides Describes the progress made in the research on polyimide materials, including polyimide films, matrices for carbon fiber composites, coatings for microelectronics and display devices, forms and fibers Presents a highly organized work that is composed of different sections that are easily compared


Author: K.L. Mittal
Publisher: Springer Science & Business Media
ISBN: 1461576377
Size: 57.29 MB
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This and its companion Volume 2 chronicle the proceedings of the First Technical Conference on Polyimides: Synthesis, Char acterization and Applications held under the auspices of the Mid Hudson Section of the Society of Plastics Engineers at Ellenville, New York, November 10-12, 1982. In the last decade or so there has been an accelerated interest in the use of polyimides for a variety of applications in a number of widely differing technologies. The applications of polyimides range from aerospace to microelectronics to medical field, and this is attributed to the fact that polyimides offer certain desirable traits, inter alia, high temperature stability. Polyimides are used as organic insulators, as adhesives, as coat ings, in composites, just to name a few of their uses. Even a casual search of the literature will underscore the importance of this class of materials and the high tempo of R&D activity taking place in the area of polyimides. So it was deemed that a conference on polyimides was both timely and needed. This conference was designed to provide a forum for discussion of various ramifications of polyimides, to bring together scientists and technologists interested in all aspects of polyimides and thus to provide an opportunity for cross-pollination of ideas, and to highlight areas which needed further and intensi fied R&D efforts. If the comments from the attendees are a baro meter of the success of a conference, then this event was highly successful and fulfilled amply its stated objectives.

Photosensitive Polyimides

Author: Takashi Yamashita
Publisher: CRC Press
ISBN: 9781566762977
Size: 30.86 MB
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This is the first book to provide an in-depth presentation of photosensitive polyimides for electronic and photonic applications. The authors are leading specialists in this field from Japan, Europe and the U.S. From the Preface Aromatic polyimides were developed originally as thermostable flexible polymer films for space applications. Now polyimides have found widespread use in the manufacture of electronic devices and have been employed in increasingly diverse areas of electronics and information technology. In addition to their excellent thermal stability and high processability, a wide range of chemical and physical properties provided by molecular engineering makes polyimides highly versatile in the electronics and information industries. Lithography of polyimides is an inevitable process in using polyimides for microelectronic fields, and hence increasing research has been devoted to developing photosensitive polyimides, which make it unnecessary to use photoresists for patterning polyimides and diminishing markedly the number of steps in fabrication of various electronic devices. In addition, the development of technology of photosensitive polyimides is expected to play a great role in manufacturing photonic devices in the near future, when the design and control of hyper fine structures . . . including higher thermal stability and better processability would be essential.